PCB Node Setup Options
The PCB node of the Process Options Editor provides the following setup options:
Shipping Cost
Include Via Plugging
By default in starting point Digital Factories, the PCB cost model assumes that liquid photo-imageable (LPI) solder mask covers any vias that are designed to be protected, resulting in via protection of type II-a (for single-sided boards) or II-b (for double-sided boards)--see the IPC standards document IPC-4761. This protection incurs no additional costs above those accounted for by the process Wet Film Solder Mask. By default, the cost model assumes there is no additional via processing. (Note that the covering is provided by LPI solder mask only; the cost model assumes no dry solder mask is used.)
Digital Factory administrators can customize the default via covering type with the cost model variable defaultEnableViaPlugging, which has the following possible values:
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false (default): covering is assumed to be provided by LPI solder mask only (type II covering with LPI solder mask only).
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true: vias are assumed to be plugged with epoxy and covered with LPI, resulting in type IV covering. The processes Plug Vias and Cure Plugged Vias are included in the process routing (in the last layer processing cycle).
To direct aPriori to assume, for a particular board, that there are vias that are plugged with epoxy (type IV), do one of the following:
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Set the setup option Include Via Plugging to true. This setup option appears under the PCB node in the process options editor.
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Manually include the routing node Via Plugging in the last Layer Processing Cycle of your process routing.
By default in starting point Digital Factories, if via processing is enabled, the cost model assumes that via processing is required on only one side of the board, that is, the cost model assumes that all covered via openings are on the same side of the board. Administrators can customize the default number of sides processed with the cost model variable defaultNumSidesPlugged (1 in starting point Digital Factories). Users can override the default on a per-part basis with the setup option Number of Sides Vias Plugged.
A via is a narrow, plated through hole that serves to conduct electrical signals between board layers or serves to improve thermal transfer. No electrical components are mounted at via openings during assembly. Via openings in outermost board layers are often covered in some way in order to protect them from unwanted solder flow during board assembly.
External Plating Thickness
By default, the copper thickness for an outermost board layer undergoing copper plating is specified by the cost model variables defaultHolesPlatingThicknessExternalLayers (1/2 oz - 18 µm in starting point Digital Factories).
With the setup option External Plating Thickness, users can override the default on a per-part basis, and choose from the values listed in the lookup table tblCopperPlatingThickness.
This value drives cycle time for the Copper Plate process.
See also Internal Plating Thickness.
Internal Plating Thickness
By default, the copper thickness for a board inner layer undergoing copper plating is specified by the cost model variable defaultHolesPlatingThicknessInternalLayers (3/8 oz - 12 µm in starting point Digital Factories).
With the setup option Internal Plating Thickness, users can override the default on a per-part basis, and choose from the values listed in the lookup table tblCopperPlatingThickness.
This value drives cycle time for the Copper Plate process.
See also External Plating Thickness.
Plating Rate
By default, the plating rate for a board inner layer undergoing copper plating is specified by the cost model variable defaultPlatingRate (18 µm/hr in starting point Digital Factories).
With the setup option Plating Rate, users can override the default on a per-part basis, and specify the plating rate in microns per hour.
This value drives cycle time for the Copper Plate process.